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Monday, June 10, 2013

Xerox Assigned Patent for Highly Integrated Wafer Bonded MEMS Devices ...

By Targeted News Service ALEXANDRIA, Va., June 10 -- Xerox, Norwalk, Conn., has been assigned a patent developed by Peter J. Nystrom, Webster, N.Y., Peter M. Gulvin, Webster, N.Y., and Paul W. Browne, Bloomfield, N.Y., for a "highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads."



via Norwalk Newswire http://technews.tmcnet.com/news/2013/06/10/7192381.htm

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